Photoresist & Photoresist Ancillaries Market worth $4.2 billion by 2025 - Exclusive Report by MarketsandMarkets™

The global photoresist and photoresist ancillaries market size is projected to reach USD 4.2 billion by 2025, at a CAGR of 4.8%. A photoresist is a light-sensitive material applied to a substrate during photolithography or photoengraving to enable the desired pattern to be imaged, i.e., a properly exposed and developed photoresist masks portions of the substrate with extremely high precision. The growing semiconductor demand and upcoming nanoelectromechanical systems (NEMS) are expected to drive the photoresist and photoresist ancillaries market.

The leading players in the global photoresist and photoresist ancillaries market include Tokyo Ohka Kogyo Co., Ltd (Japan), JSR Corporation (Japan), DuPont (US), Shin-Etsu Chemical Co., Ltd (Japan), Fujifilm Corporation (Japan), Sumitomo Chemical Co., Ltd. (Japan), ALLRESIST (Germany), Merck Group (Germany), Micro Resist Technology (Germany), and DJ MicroLaminates (US).

JSR Corporation (Japan) is one of the most extensive rubber & chemical solutions offering companies worldwide. The company operates through four business segments: elastomers business, plastic business, digital solution business, and life sciences business. It offers photoresist materials under the digital solution business. The company has a presence in 41 overseas locations, including the US, Europe, China, South Korea, Taiwan, and Thailand.

TOKYO OHKA KOGYO CO., LTD is a material manufacturing company focusing mainly on photoresists and high-purity chemicals for the photolithography process of semiconductor and display, processing equipment for semiconductor and display manufacturing, and inorganic and organic chemicals. The company headquarters is in Japan and operates through two business segments: material business and equipment business. The company offers photoresist products through the material business segment. Moreover, it has a strong presence in APAC, North America, and Europe.


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