Unfilled polyimide wafers are typically smaller in size and thinner than polyimide substrates, and they are often used as a base material for the fabrication of microelectronic devices, such as MEMS structures, thin films, and solar cells. Polyimide substrates, on the other hand, are larger in size and thicker than unfilled polyimide wafers. They are used as a base material for the fabrication of printed circuit boards (PCBs), flexible circuits, and other electronic components.

Description: Valley Design stocks and processes a wide variety of materials for information display and related applications. These materials come in standard sizes or can be machined to your custom specifications.

Flatlapping is the leading provider of contract precision lapping, grinding and flat lapping services with high quality surface finishes to make sure the best possible performance for your components.

Make use of proprietary technology, Precision-metal-optics.com can now make Angstrom level optical surface finishes on these pure metal mirrors.

Quartz-silica.net is the leading provider of precision lapping, thinning, polishing, backgrinding, hole drilling, wafering, and dicing services for optics, photonics and semiconductor.

Stainless Steel wafers and substrates may be utilized for different applications such as solar cells, thick film circuitry, heaters, and for lots of R&D and medical applications.

Fused Silica wafers is made from a silicon-rich chemical forerunner resulting visible glass with an ultra-high purity and improved optical transmission.

Flatlapping.com is the leading provider of contract precision lapping, grinding and optical polishing services, in the Boston, MA area.

Polyimide-substrates.com provides lapping, polishing and precision sizing of all polymer wafers and substrates with no size or thickness limitations.

The variety of manufacturing technique and the raw materials utilized dictate the final properties of the fused quartz produced.

Sapphirewafers offers thinning and polishing services on customer supplied SOS wafers. Also provides backthinning services to thin SOS wafers to as thin as 125um thick.

Sapphire wafer services provided by Utra-thin.com include dicing, sapphire cnc machining, backgrinding , hole drilling, and edge and angle polishing.

Valley Design provides contract lapping and polishing services, operating from 30,000 sq.ft. facilities in the Boston, MA area. Place and order now.

Quartz CNC Machining has experience with all these types of quartz, and offers a full range of services from precision lapping and polishing, CNC machining, hole drilling and dicing.

Float Zone Silicon, available in P-type boron doped and N-type phosphorous doped also with high resistivity approaching 100,000 ohm-cm in 1-1-1 and 1-0-0 orientations up to 100 mm diameter can be custom diced and thinned by Valley Design.

Valley Design is in the midst of this development providing 450mm diameter ceramics, 450mm glass wafers, wafer backlapping, thinning, edge rounding, stress relieving, hole drilling and other machining services related to the manufacture of 450mm wafers and 450mm technology.

Utilizing its proprietary technology, Precision-metal-optics.com can now fabricate Angstrom level optical surface finishes on these pure metal mirrors, eliminating.