3D IC and 2.5D IC Packaging Market Technology, Applications and...

3D IC and 2.5D IC packaging technologies are primarily utilized in enhancing the performance and efficiency of semiconductor devices. They are widely used in applications such as logic devices, memory devices, MEMS/sensors, imaging and optoelectronics, and LEDs. These applications benefit from the high bandwidth, improved thermal performance, and reduced power consumption offered by 3D and 2.5D packaging technologies. For instance, the technology is critical in high-performance computing, data centers, and consumer electronics, enabling more compact and powerful devices.


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